Electronic circuit packages
This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimeter wave, and sub-millimeter wave bands. The invention provides a package incorporating a cavity in a material for containment of the c...
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| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
26.10.2010
|
| Online Access | Get full text |
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