Electronic circuit in a package-in-package configuration and production method
An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-conn...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
11.05.2010
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Online Access | Get full text |
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Abstract | An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-connection, at least one inner lead running within the encapsulation, and at least one outer contact-connection led out from the encapsulation. The inner lead has an exposed inner lead section which can be contact-connected from the outer side of the package-in-package configuration. |
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AbstractList | An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-connection, at least one inner lead running within the encapsulation, and at least one outer contact-connection led out from the encapsulation. The inner lead has an exposed inner lead section which can be contact-connected from the outer side of the package-in-package configuration. |
Author | Heitzer, Ludwig Stuempfl, Christian Bauer, Michael |
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References | Biswas et al. (5053852) 19911000 Chiang (7227249) 20070600 Kitano et al. (5608265) 19970300 Michii (6323545) 20011100 Hara (5498902) 19960300 Casto (5172214) 19921200 (0465143) 19920100 Koon et al. (2005/0026325) 20050200 Kelkar et al. (6803648) 20041000 Crowley et al. (6605866) 20030800 Ichinose (6747361) 20040600 |
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Snippet | An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an... |
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