Lightweight circuit board with conductive constraining cores
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermal...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
23.02.2010
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Online Access | Get full text |
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Abstract | Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. |
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AbstractList | Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. |
Author | Davis, William E Mangrolia, Bharat M Bohner, Richard A Vasoya, Kalu K |
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References | (2004-355203) 20041200 Leibowitz (4812792) 19890300 Leibowitz (4689110) 19870800 Desai (5004639) 19910400 (0313961) 19890500 Japp et al. (6329603) 20011200 Leibowitz (4591659) 19860500 Dietz, Karl, "Fine Lines in High Yield (Part LXXX): Problems with Residual, Excess Copper in Print/Etch and Tent/Etch Processes (Part C)", Tech Talk, 2005, printout from Circuitree website by BNP Media; 5 pp. Schmidt et al. (5746929) 19980500 Schmidt et al. (5382505) 19950100 Meier, Dr. Dieter J. et al., "Laser Structuring of Fine Lines", posted on Sep. 1, 2000, at http://www.CircuiTree.com/ (7 pgs.). Ogihara et al. (4299873) 19811100 Schmidt et al. (5436062) 19950700 (WO 97/17199) 19970500 "High-Performance DYCOstrate™ MLBs", DYCONEX Advanced Circuitry Technology pamphlet; 11 pp. Collins et al. (5646373) 19970700 "Thermal Management of Electronics", The 5th International Business and Technology Summit, Aug. 17-18, 2005, Natick, MA, Show brochure and documents, ˜ 465 pp. (2-sided). Tani et al. (6869665) 20050300 (2248725) 19920400 Bovensiepen et al. (6222740) 20010400 (1 821 586) 20070800 Dyconex-Technologies & Products-Products-CTE Matched MLB, Oct. 4, 1997, printout from dyconex.com website, 3 pp. Middelman et al. (6016598) 20000100 Tani et al. (7002080) 20060200 Afzali-Ardakani et al. (5527838) 19960600 Durand et al. (5326636) 19940700 Meier, Dr. Dieter J. and Agater, Michael, "Lasering Structuring of Fine Lines", posted Sep. 1, 2000, (7 pp.). Ozaki (6013588) 20000100 Dietz, Karl, "Tech Talk-Karl Dietz/Fine Lines in High Yield (Part LXXX): Problems with Residual, Excess Copper in Print/Etch and Tent/Etch Processes (Part C)", posted on May 1, 2002, at http://www.CircuiTree.com/ (5 pgs.). Zweben et al. (4888247) 19891200 Kramer et al. (6207904) 20010300 Schmidt et al. (6486394) 20021100 (WO 95/02505) 19950100 Jensen (4318954) 19820300 |
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Title | Lightweight circuit board with conductive constraining cores |
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