Rapid thermal processing using energy transfer layers
A method that is performed for heat treating a semiconductor wafer in a process chamber, as an intermediate part of an overall multi-step technique for processing the wafer, includes applying an energy transfer layer to at least a portion of the wafer, and exposing the wafer to an energy source in t...
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Main Author | |
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Format | Patent |
Language | English |
Published |
05.01.2010
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Online Access | Get full text |
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