Rapid thermal processing using energy transfer layers

A method that is performed for heat treating a semiconductor wafer in a process chamber, as an intermediate part of an overall multi-step technique for processing the wafer, includes applying an energy transfer layer to at least a portion of the wafer, and exposing the wafer to an energy source in t...

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Bibliographic Details
Main Author Timans, Paul J
Format Patent
LanguageEnglish
Published 05.01.2010
Online AccessGet full text

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