Method of depositing an amorphous carbon film for etch hardmask application

Methods are provided for depositing amorphous carbon materials. In one aspect, the invention provides a method for processing a substrate including forming a dielectric material layer on a surface of the substrate, depositing an amorphous carbon layer on the dielectric material layer by introducing...

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Bibliographic Details
Main Authors Wang, Yuxiang May, Rathi, Sudha S. R, Kwan, Michael Chiu, M'Saad, Hichem
Format Patent
LanguageEnglish
Published 29.12.2009
Online AccessGet full text

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