Microjet module assembly
Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
14.04.2009
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Online Access | Get full text |
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Abstract | Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops. |
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AbstractList | Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops. |
Author | Bezama, Raschid J Toy, Hilton T Natarajan, Govindarajan Sikka, Kamal K |
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References | Nakajima et al. (5270572) 19931200 Schmidt (3909118) 19750900 Chu et al. (5269372) 19931200 Cole et al. (2002/0163782) 20021100 Lu et al. (2006/0042825) 20060300 Agonafer et al. (6431260) 20020800 Bland et al. (4494171) 19850100 Quon et al. (5316075) 19940500 Slocum et al. (7004235) 20060200 Newton et al. (6459581) 20021000 Campbell et al. (2006/0250774) 20061100 Tousignant et al. (5249358) 19931000 Patel et al. (6550263) 20030400 Chrysler et al. (6650542) 20031100 Johnson et al. (2006/0175041) 20060800 Haas et al. (4209129) 19800600 Downing (4910642) 19900300 |
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