Methods for forming semiconductor structures with buried isolation collars
A semiconductor structure including a trench formed in a substrate and a buried isolation collar that extends about sidewalls of the trench. The buried isolation collar is constituted by an insulator formed from a buried porous region of substrate material. The porous region is formed from a buried...
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Format | Patent |
Language | English |
Published |
16.12.2008
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Online Access | Get full text |
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Abstract | A semiconductor structure including a trench formed in a substrate and a buried isolation collar that extends about sidewalls of the trench. The buried isolation collar is constituted by an insulator formed from a buried porous region of substrate material. The porous region is formed from a buried doped region defined using masking and ion implantation or by masking the trench sidewalls and using dopant diffusion. Advantageously, the porous region is transformed to an oxide insulator by an oxidation process. The semiconductor structure may be a storage capacitor of a memory cell further having a buried plate about the trench and a capacitor node inside the trench that is separated from the buried plate by a node dielectric formed on the trench sidewalls. |
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AbstractList | A semiconductor structure including a trench formed in a substrate and a buried isolation collar that extends about sidewalls of the trench. The buried isolation collar is constituted by an insulator formed from a buried porous region of substrate material. The porous region is formed from a buried doped region defined using masking and ion implantation or by masking the trench sidewalls and using dopant diffusion. Advantageously, the porous region is transformed to an oxide insulator by an oxidation process. The semiconductor structure may be a storage capacitor of a memory cell further having a buried plate about the trench and a capacitor node inside the trench that is separated from the buried plate by a node dielectric formed on the trench sidewalls. |
Author | Mandelman, Jack Allan Cheng, Kangguo |
Author_xml | – sequence: 1 givenname: Kangguo surname: Cheng fullname: Cheng, Kangguo – sequence: 2 givenname: Jack Allan surname: Mandelman fullname: Mandelman, Jack Allan |
BookMark | eNqNik0KwkAMRmehC__ukAsIorU9gCgiuHMv40zaBqaJTDJ4fVvwAC4e7_HxLd2MhXHhbne0XqJCK3liIO5AcaAgHEuwcVXLY5SMCh-yHl4lE0YgleSNhCFISj7r2s1bnxQ3P68cXM6P03Vb9O0N2fTZZT9p11T1sa72hz8uX4JCOMo |
ContentType | Patent |
CorporateAuthor | International Business Machines Corporation |
CorporateAuthor_xml | – name: International Business Machines Corporation |
DBID | EFH |
DatabaseName | USPTO Issued Patents |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EFH name: USPTO Issued Patents url: http://www.uspto.gov/patft/index.html sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
ExternalDocumentID | 07465642 |
GroupedDBID | EFH |
ID | FETCH-uspatents_grants_074656423 |
IEDL.DBID | EFH |
IngestDate | Sun Mar 05 22:33:38 EST 2023 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-uspatents_grants_074656423 |
OpenAccessLink | https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7465642 |
ParticipantIDs | uspatents_grants_07465642 |
PatentNumber | 7465642 |
PublicationCentury | 2000 |
PublicationDate | 20081216 |
PublicationDateYYYYMMDD | 2008-12-16 |
PublicationDate_xml | – month: 12 year: 2008 text: 20081216 day: 16 |
PublicationDecade | 2000 |
PublicationYear | 2008 |
References | Kokubun (6635915) 20031000 Chen et al. (2002/0072206) 20020600 Aboaf et al. (4016017) 19770400 Kenney (6020250) 20000200 Schrems (6008104) 19991200 Tews et al. (6599798) 20030700 Chidambarrao et al. (2007/0122956) 20070500 |
References_xml | – year: 20000200 ident: 6020250 contributor: fullname: Kenney – year: 19770400 ident: 4016017 contributor: fullname: Aboaf et al. – year: 20031000 ident: 6635915 contributor: fullname: Kokubun – year: 20030700 ident: 6599798 contributor: fullname: Tews et al. – year: 20070500 ident: 2007/0122956 contributor: fullname: Chidambarrao et al. – year: 19991200 ident: 6008104 contributor: fullname: Schrems – year: 20020600 ident: 2002/0072206 contributor: fullname: Chen et al. |
Score | 2.7196302 |
Snippet | A semiconductor structure including a trench formed in a substrate and a buried isolation collar that extends about sidewalls of the trench. The buried... |
SourceID | uspatents |
SourceType | Open Access Repository |
Title | Methods for forming semiconductor structures with buried isolation collars |
URI | https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7465642 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH_MIagnRcX5RQ5eo2mbdOl5rJTBZAeF3UbbJCK4diwd_vu-l8rw4g65vEDySPI-En75PYAnrVTihKm4jOuEy8xanukU7aqOhRFOqNrRg_78NS3e5WyplgMo9n9h1mhGfIO6-Oed33RtAFeie-83nvfkz8QR2BD7wHfz1ZZmYdzLmIi_JDrjIy0I2jXNizM4wSEwZWs6_ydo5OdwvAjSCxjY5hJm81Cs2TNME6mtMWgwT9j0tiHSVZT2ZK47vAEzeh9lFdWTM-wTz0dYQBZ2beuvgOXTt0nB9xOvPrYEaFmJXwWTaxjixd7eACuFxXheUrULKcdSlybW1mSRzZSTlbUjGP07zO2Bvjs4DaiGKOZReg9D1N0-YOjsqsewLj_QfHvP |
link.rule.ids | 230,309,786,808,891,64396 |
linkProvider | USPTO |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV07T8MwED5VBfGYQIAo5eGB1eAkTprM0CgUWmUAqVuUxA5CoklVp-rf752DKhYYvJwl-_w4f2fr_B3Afej7XiVUwaVbelxGWvMoDNCuSlcoUQm_rOhBfzoLkg85mfvzHiS7vzALNCO-RF3Mw9os28YGV-Lx3i0878ifiSOwJvaBTf3d5CpV1eOIiL8kHsZ7hLG018dxcgyH2Ag6bXVrfsFGfAL7qZWeQk_XZzCZ2nTNhqGjSGWBsMEMRac3NdGuorSjc13jHZjRCykrKKOcYl-4Q-wUMrtuK3MOLB6_PyV813H2uaKQlkz8qOhdQB-v9voSWC40InpO-S6kHMkwV26oVeToyK9kofUABn82c_VP3R0cpM9x9vYyex3CkQ1xcFzuBNfQx2HoG8TRtri1U7QFCqN-yw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Methods+for+forming+semiconductor+structures+with+buried+isolation+collars&rft.inventor=Cheng%2C+Kangguo&rft.inventor=Mandelman%2C+Jack+Allan&rft.number=7465642&rft.date=2008-12-16&rft.externalDBID=n%2Fa&rft.externalDocID=07465642 |