Semiconductor device substrate, semiconductor device, and manufacturing method thereof

A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base...

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Bibliographic Details
Main Authors Ooi, Kiyoshi, Horikawa, Yasuyoshi, Rokugawa, Akio
Format Patent
LanguageEnglish
Published 15.04.2008
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