Semiconductor device having post-mold nickel/palladium/gold plated leads
abA semiconductor device having a leadframe comprised of a base metal (, e.g., copper), a chip mount pad and a plurality of lead segments. Each of the segments has a first end near the mount pad and a second end remote from the mount pad. The device further has a semiconductor chip attached to the m...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
11.09.2007
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Abstract | abA semiconductor device having a leadframe comprised of a base metal (, e.g., copper), a chip mount pad and a plurality of lead segments. Each of the segments has a first end near the mount pad and a second end remote from the mount pad. The device further has a semiconductor chip attached to the mount pad and electrical interconnections between the chip and the first segment ends. Encapsulation material covers the chip, the bonding wires and the first segment ends, yet leaves the second segment ends exposed. At least portions of the second segment ends have the base metal covered by a layer of solderable metal (, e.g., nickel) and by an outermost layer of noble metal (, e.g., stack of palladium and gold). |
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AbstractList | abA semiconductor device having a leadframe comprised of a base metal (, e.g., copper), a chip mount pad and a plurality of lead segments. Each of the segments has a first end near the mount pad and a second end remote from the mount pad. The device further has a semiconductor chip attached to the mount pad and electrical interconnections between the chip and the first segment ends. Encapsulation material covers the chip, the bonding wires and the first segment ends, yet leaves the second segment ends exposed. At least portions of the second segment ends have the base metal covered by a layer of solderable metal (, e.g., nickel) and by an outermost layer of noble metal (, e.g., stack of palladium and gold). |
Author | Zuniga-Ortiz, Edgar R Abbott, Donald C |
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References | Abbott (6245448) 20010600 Abbott et al. (6953986) 20051000 Abbott (6545344) 20030400 Motonami et al. (6664136) 20031200 Miyaki et al. (6891253) 20050500 Miyaki et al. (7038306) 20060500 Miyaki et al. (6960823) 20051100 Seki et al. (6593643) 20030700 Tsuji et al. (5521432) 19960500 Kubara et al. (6646330) 20031100 Abys et al. (6452258) 20020900 Abbott (6828660) 20041200 Abbott et al. (6583500) 20030600 Abbott et al. (6713852) 20040300 Abbott et al. (6838757) 20050100 Sugihara et al. (6392293) 20020500 Kinghorn (5635755) 19970600 Yeh et al. (6287896) 20010900 Park et al. (6518508) 20030200 Abbott (6376901) 20020400 Abbott et al. (6194777) 20010200 Huang et al. (5889317) 19990300 |
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Snippet | abA semiconductor device having a leadframe comprised of a base metal (, e.g., copper), a chip mount pad and a plurality of lead segments. Each of the segments... |
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Title | Semiconductor device having post-mold nickel/palladium/gold plated leads |
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