Attachment of integrated circuit structures and other substrates to substrates with vias

• Main Authors: Savastiouk, Sergey, Kao, Sam
• Format: Patent
• Language: English
• Published: 10.07.2007

Vias (B) are formed in a surface of a substrate. At least portions of contact pads are located in the vias. Contact pads of an integrated circuit structure are inserted into the vias and attached to the contact pads of the substrate. The vias provide a strong, reliable mechanical and electrical conn...