Attachment of integrated circuit structures and other substrates to substrates with vias

Vias (B) are formed in a surface of a substrate. At least portions of contact pads are located in the vias. Contact pads of an integrated circuit structure are inserted into the vias and attached to the contact pads of the substrate. The vias provide a strong, reliable mechanical and electrical conn...

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Main Authors Savastiouk, Sergey, Kao, Sam
Format Patent
LanguageEnglish
Published 10.07.2007
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Abstract Vias (B) are formed in a surface of a substrate. At least portions of contact pads are located in the vias. Contact pads of an integrated circuit structure are inserted into the vias and attached to the contact pads of the substrate. The vias provide a strong, reliable mechanical and electrical connection. A via may expose not only a contact pad in the substrate but also a surrounding region. Solder wets the contact pad better than the surrounding region, resulting in a stronger solder joint and better electrical conductivity. Alternatively, the contact may include multiple conductive layers, with the top layer being more solder wettable than the bottom layer and the top layer covering only a portion of the bottom layer.
AbstractList Vias (B) are formed in a surface of a substrate. At least portions of contact pads are located in the vias. Contact pads of an integrated circuit structure are inserted into the vias and attached to the contact pads of the substrate. The vias provide a strong, reliable mechanical and electrical connection. A via may expose not only a contact pad in the substrate but also a surrounding region. Solder wets the contact pad better than the surrounding region, resulting in a stronger solder joint and better electrical conductivity. Alternatively, the contact may include multiple conductive layers, with the top layer being more solder wettable than the bottom layer and the top layer covering only a portion of the bottom layer.
Author Kao, Sam
Savastiouk, Sergey
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