Methods and apparatus for thermal management of an integrated circuit die
An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visib...
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Format | Patent |
Language | English |
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02.01.2007
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Abstract | An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system. |
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AbstractList | An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system. |
Author | Carmean, Douglas M Bauer, John M Gunther, Stephen H Pippin, Jack D Rankin, Linda J Binns, Frank Burton, Edward A |
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References | Palara (5008771) 19910400 Hinrichs et al. (5453682) 19950900 (0523736) 19930100 Rotier et al. (5586270) 19961200 Cacciatore (4799176) 19890100 Gose et al. (5675297) 19971000 Trachier et al. (H562) 19881200 Nelson (4789819) 19881200 Barret et al. (5560017) 19960900 Anderson et al. (4924112) 19900500 Bergeron (5025248) 19910600 Heck et al. (5077491) 19911200 Blackburn (4591855) 19860500 Joehlin et al. (4807144) 19890200 Fraden (RE34789) 19941100 Marco Ferro et al., "A Floating CMOS Bandgap Voltage Reference for Differential Applications", IEEE Journal of Solid-State Circuits, vol. 24, No. 3, Jun. 1989, p. 690-697, ISSN 0018-9200. Shu-Yuan Chin et al., "A New Type of Curvature-Compensated CMOS Bandgap Voltage References", VLSITSA, 1991, 6 pages, IEEE Catalog No. 91TH0368-1, ISBN 0-7803-0035-X. Pippen (5838578) 19981100 Kinoshita et al. (5149199) 19920900 Beckey (5105366) 19920400 O. Salminen et al., "The Higher Order Temperature Compensation of Bandgap Voltage References", IEEE International Symposium on Circuits and Systems, vol. 3, San Diego, California, May 10-13, 1992, p. 1388-1391. Kenny et al. (5287292) 19940200 Koerner et al. (5283631) 19940200 Booner (5256914) 19931000 Ristic et al. (5291607) 19940300 Sawtell et al. (5085526) 19920200 Atriss et al. (5359234) 19941000 Evoy (5713030) 19980100 Georgiou et al. (5189314) 19930200 Berton et al. (5170344) 19921200 Salesky et al. (5087870) 19920200 Salem (4488824) 19841200 Wolrich et al. (6101516) 20000800 Matsuo (5255149) 19931000 Signore et al. (5440305) 19950800 Analog Devices, Inc. brochure, "Low Power, Programmable Temperature Controller: TMP01", Rev. C., 1995, p. 1-16. Huijsing et al. (5064296) 19911100 Weng et al. (5325286) 19940600 Hector Sanchez et al., "Thermal Management System for High Performance POWERPC Microprocessors", IEEE CompCon 97, San Jose, California, Feb. 23-26, 1997, p. 325-330, IEEE Computer Society Press, Los Alamitos, California. Phillip E. Allen et al., "CMOS Analog Circuit Design", 1987, p. 529-551, ISBN 0-03-006587-9, Holt, Rinehart and Winston, New York, New York. Levine (RE32960) 19890600 Fukunaga et al. (4903106) 19900200 Moyal (5422832) 19950600 Hussain et al. (6172611) 20010100 Kardash (6137329) 20001000 Schmidt et al. (4935864) 19900600 Giordano et al. (5359236) 19941000 DeShazo, Jr. (4779161) 19881000 Audy et al. (5195827) 19930300 Bhatnagar (6336593) 20020100 Stixrud (5253938) 19931000 Matsumura et al. (4787007) 19881100 Sahay et al. (4442972) 19840400 Chan Shu-Park 'section I, Circuits' The electrical Engineering handbook, Ed. Richard C. Dorf, Boca raton: CRC Press LLC, 2000, p. 1. |
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