Method of manufacturing semiconductor device
Extremely thin chips laminated to a non-ultraviolet ray curing type adhesive tape are peeled from the tape without giving rise to cracks and chippings. In a center portion of a suction block used for peeling off a chip laminated to a dicing tape, three blocks which push the dicing tape upwardly are...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
03.10.2006
|
| Online Access | Get full text |
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