Adjustable self-aligned air gap dielectric for low capacitance wiring

An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interc...

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Main Authors Geffken, Robert M, Motsiff, William T
Format Patent
LanguageEnglish
Published 04.07.2006
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Abstract An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interconnects. The air gap extends above an upper surface of at least one of the first and second interconnects and below a lower surface of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
AbstractList An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interconnects. The air gap extends above an upper surface of at least one of the first and second interconnects and below a lower surface of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
Author Geffken, Robert M
Motsiff, William T
Author_xml – sequence: 1
  givenname: Robert M
  surname: Geffken
  fullname: Geffken, Robert M
– sequence: 2
  givenname: William T
  surname: Motsiff
  fullname: Motsiff, William T
BookMark eNqNyksKwjAQANAsdOHvDnOBQrVI1yIVD-BexskkjAyTkKT0-iJ4AFdv87ZuZcl446aLf8-14UsZKmvoUCUae0ApEDGDF1amVoQgpAKaFiDMSNLQiGGRIhb3bh1QKx9-7hzcpsf13s01Y2Nr9RkLfunHfjyeh9PwR_kAskU1lQ
ContentType Patent
CorporateAuthor International Business Machines Corporation
CorporateAuthor_xml – name: International Business Machines Corporation
DBID EFH
DatabaseName USPTO Issued Patents
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFH
  name: USPTO Issued Patents
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 07071532
GroupedDBID EFH
ID FETCH-uspatents_grants_070715323
IEDL.DBID EFH
IngestDate Sun Mar 05 22:33:17 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_grants_070715323
OpenAccessLink https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7071532
ParticipantIDs uspatents_grants_07071532
PatentNumber 7071532
PublicationCentury 2000
PublicationDate 20060704
PublicationDateYYYYMMDD 2006-07-04
PublicationDate_xml – month: 07
  year: 2006
  text: 20060704
  day: 04
PublicationDecade 2000
PublicationYear 2006
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V. Arnal, J. Torres, P. Gayet, R. Gonella, P. Spinelli, M. Guillermet, J-P Reynard, GC. Verove; "Integration of a 3 Level CuSiO2 Air Gap Interconnect for Sub 0.1 micron DMOS Technologies;" IEEE, Jun. 2001, pp. 298-300.
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References_xml – year: 20010900
  ident: 2001/0023123
  contributor:
    fullname: Kim
– year: 20010300
  ident: 6200900
  contributor:
    fullname: Kitch
– year: 20010800
  ident: 6281585
  contributor:
    fullname: Bothra
– year: 20020900
  ident: 2002/0127844
  contributor:
    fullname: Grill et al.
– year: 19940600
  ident: 5324683
  contributor:
    fullname: Fitch et al.
– year: 20010400
  ident: 6211057
  contributor:
    fullname: Lin et al.
– year: 20050100
  ident: 6838354
  contributor:
    fullname: Goldberg et al.
– year: 20030400
  ident: 6545361
  contributor:
    fullname: Ueda et al.
– year: 20040500
  ident: 2004/0097065
  contributor:
    fullname: Lur et al.
– year: 19920500
  ident: 5117276
  contributor:
    fullname: Thomas et al.
– year: 20020700
  ident: 6413852
  contributor:
    fullname: Grill et al.
– year: 20001100
  ident: 6150232
  contributor:
    fullname: Chan et al.
– year: 20020700
  ident: 6423629
  contributor:
    fullname: Ahn et al.
– year: 20011200
  ident: 6329279
  contributor:
    fullname: Lee
– year: 19960400
  ident: 5510645
  contributor:
    fullname: Fitch et al.
– year: 20021000
  ident: 6472266
  contributor:
    fullname: Yu et al.
Score 2.64577
Snippet An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an...
SourceID uspatents
SourceType Open Access Repository
Title Adjustable self-aligned air gap dielectric for low capacitance wiring
URI https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7071532
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NS8QwEB3WRVBPioq7fpCD12hr2qYeRVqKoOxBYW9LMk1Lpbal7dK_76SVxYteE0iGDPPezDAzAbh9eJTKDaXmgRCCewbJpEKfFGK1LXSACm2D8-tbkHx4L2t_PYNk1wvzRWbEG5Klu9t2TV-PxZUE75Pi-TT82c4IrOz0gaEqa5Wu0uxeElf6gsB4L3RsaV8UJ0dwQEeQy1b13S_SiI9hfzWunsDMVKcQPaWftltJl4Z1psw4ecA5gRxTRcty1bC0mP6kKZCRJ8nKemBIVIYUvZNm2FDYFNwZsDh6f0747s5N3tpalo3zI5s4hznF9OYCWIgm81wUrkCCKmWURjItiTKTxBepu4DFn8cs_9m7hMMpRyC5413BvG-35ppYs9c345N8A5jkeFM
link.rule.ids 230,309,783,805,888,64375
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4QwEJ5sVuPjpFHj-uzBa3WxQPFoFIKvDQdN9kbaUggGgQAb_r5TMBsvem2T6aSTmW9mOjMFuLq948LyuKQuY4zaWqFKeQ4KxEibSVcJZRqc3xZu-GE_L53lBMJ1L8wXqhGtkZf2etXWXTUUV6J5HwVPx-HPZkZgaaYP9GVRiSRK0huOWOkwNMYb5inKFPf5QbgL20gEnbaya3_BRrAHm9Gwug8TXR6Af598mn4lWWjS6iKl6ANnaOaIyBuSiZok-fgrTa4I-pKkqHqiEMwUxu8oG9LnJgl3CCTw3x9Cuj4zzhpTzRLPf7hjRzDFqF4fA_GUTm1LMYspNFZCC6lQubjiKUfESKwZzP4kc_LP3iVsRY9B_Pq0eDmFnTFhwOncPoNp16z0OUJoJy-G2_kGqcl7Tw
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Adjustable+self-aligned+air+gap+dielectric+for+low+capacitance+wiring&rft.inventor=Geffken%2C+Robert+M&rft.inventor=Motsiff%2C+William+T&rft.number=7071532&rft.date=2006-07-04&rft.externalDBID=n%2Fa&rft.externalDocID=07071532