Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated result...

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Main Authors Uragami, Hiroshi, Nakagawa, Osamu, Fujino, Kinya, Takase, Shinji, Tokuyama, Hideki, Meguro, Koichi, Nishino, Toru, Hayasaka, Noboru
Format Patent
LanguageEnglish
Published 06.06.2006
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Abstract First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
AbstractList First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
Author Tokuyama, Hideki
Hayasaka, Noboru
Nakagawa, Osamu
Fujino, Kinya
Takase, Shinji
Meguro, Koichi
Uragami, Hiroshi
Nishino, Toru
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References (05198707) 19930800
Yamamoto (2001/0008775) 20010700
Thummel (6287503) 20010900
Utsumi et al. (6081978) 20000700
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Takahashi et al. (6596561) 20030700
(41 02 934) 19910800
Mess (6335221) 20020100
Tsai et al. (2003/0235636) 20031200
Osada et al. (5435953) 19950700
Miyajima (6187243) 20010200
Banjo et al. (5123823) 19920600
(01097622) 19890400
Inoue et al. (5733802) 19980300
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