Integrated power module with reduced thermal impedance

A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn reduces the temperature rise of the junction temperature of the power devices inside the power module by 20%...

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Main Authors Chang, Jie, Chiu, Stephen, Morris, Winfred
Format Patent
LanguageEnglish
Published 24.01.2006
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Abstract A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn reduces the temperature rise of the junction temperature of the power devices inside the power module by 20% with an equivalent load current. As a consequence the weight and volume associated with the conventional cooling mechanism not employing a dual thermal interface is reduced, thus increasing the ambient operating temperature limit of a power converter in the module.
AbstractList A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the power module by 20%. This in turn reduces the temperature rise of the junction temperature of the power devices inside the power module by 20% with an equivalent load current. As a consequence the weight and volume associated with the conventional cooling mechanism not employing a dual thermal interface is reduced, thus increasing the ambient operating temperature limit of a power converter in the module.
Author Chiu, Stephen
Chang, Jie
Morris, Winfred
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References Liu et al. (6442033) 20020800
Bailey (5309983) 19940500
Allman (6181556) 20010100
Vandentop et al. (6580611) 20030600
Ma et al. (6229216) 20010500
(Exhibit 2) Circuit schematic of Integrated Power Module and package outline illustration, CM25MD-24H, Jul. 1997, POWEREX Inc, Youngwood, PA, USA, Tel 412 925 7272.
(Exhibit 3) An example of a damaged prototype of an Integrated Power Module of modified CM25MD-24H. The damage is due to improper contact of the thermal-interface material that has low or insufficient di-electrical strength. May 25, 2004, Dr. Jie Chang, U.S.A. The damaged example module is available for inspection.
(Exhibit 1) POWEREX CM25MD-24H product specification sheets, (2 pages). Jul. 1997. Powerex, Inc., Youngwood, PA, USA, Tel 412 925 7272. The power module and internal power devices are rated at 1200 V, 25 A. It integrated in: a 3-phase IGBT inverter bridge consisting 6 IGBT devices and 6 power diode devices, a 3-phase uncontrolled rectifier bridge consisting 6 power diode devices and a DC-link voltage brake device as shown in a circuit schematic in Exhibit 2.
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Snippet A dual-side thermal interface and cooling design of an integrated power module is disclosed which effectively reduces the equivalent thermal impedance on the...
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Title Integrated power module with reduced thermal impedance
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