Semiconductor device with improved reliability and manufacturing method of the same
A semiconductor device includes an insulating layer, a conducting portion, and a modified layer. The insulating layer is formed on a semiconductor substrate. The conducting portion is formed in the insulating layer. The modified layer is formed between the insulating layer and the conducting portion...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
10.01.2006
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| Online Access | Get full text |
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