Bonding apparatus and bonding method having process for judging bonding state

In a bonding apparatus having an ultrasonic horn coupled to an ultrasonic vibrator and a bonding tool coupled to the ultrasonic horn , and applying ultrasonic bonding to a work , by providing an ultrasonic detector and an indicator for displaying an output signal from the ultrasonic detector , there...

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Main Authors Kanemoto, Mitsunori, Sueda, Hiromi, Takamura, Keiji
Format Patent
LanguageEnglish
Published 08.11.2005
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Abstract In a bonding apparatus having an ultrasonic horn coupled to an ultrasonic vibrator and a bonding tool coupled to the ultrasonic horn , and applying ultrasonic bonding to a work , by providing an ultrasonic detector and an indicator for displaying an output signal from the ultrasonic detector , there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.
AbstractList In a bonding apparatus having an ultrasonic horn coupled to an ultrasonic vibrator and a bonding tool coupled to the ultrasonic horn , and applying ultrasonic bonding to a work , by providing an ultrasonic detector and an indicator for displaying an output signal from the ultrasonic detector , there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.
Author Takamura, Keiji
Sueda, Hiromi
Kanemoto, Mitsunori
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Franklin et al. (6628408) 20030900
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Title Bonding apparatus and bonding method having process for judging bonding state
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