Solder dross removal apparatus and method

A solder dross removal apparatus includes a holder adapted to be pivotably mounted to a container within which a pool of molten solder is kept at preset temperature. Dross is introduced into the container. A dross cutter assembly includes shafts rotatably supported by the holder and flat elongated c...

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Main Author Mawatari, Shohei
Format Patent
LanguageEnglish
Published 10.05.2005
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Abstract A solder dross removal apparatus includes a holder adapted to be pivotably mounted to a container within which a pool of molten solder is kept at preset temperature. Dross is introduced into the container. A dross cutter assembly includes shafts rotatably supported by the holder and flat elongated cutter elements mounted on the shafts. The cutter elements are disposed perpendicular to the surface of the molten solder and partly submerged in the molten solder when the container is closed by the holder. The cutter elements are angularly offset from each other so that each end of the cutter elements lies on a spiral path. The cutter elements are rotated to repeatedly cut the dross into smaller pieces and force the dross as cut into the molten solder. This process removes oxides from the dross, and any free, reclaimed solder is returned to the molten solder.
AbstractList A solder dross removal apparatus includes a holder adapted to be pivotably mounted to a container within which a pool of molten solder is kept at preset temperature. Dross is introduced into the container. A dross cutter assembly includes shafts rotatably supported by the holder and flat elongated cutter elements mounted on the shafts. The cutter elements are disposed perpendicular to the surface of the molten solder and partly submerged in the molten solder when the container is closed by the holder. The cutter elements are angularly offset from each other so that each end of the cutter elements lies on a spiral path. The cutter elements are rotated to repeatedly cut the dross into smaller pieces and force the dross as cut into the molten solder. This process removes oxides from the dross, and any free, reclaimed solder is returned to the molten solder.
Author Mawatari, Shohei
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References (2001-234258) 20010800
Patent Abstracts of Japan, entitled " Method and Device for Reducing Solder Dross ", vol. 1998, No. 11, Sep. 30, 1998 & JP 10-163617 A (Sony Corp.), Jun. 19, 1998.
Willemen (6578752) 20030600
Stevenson (5061380) 19911000
McDonald (6666370) 20031200
(00 02695) 20000100
De Visser et al. (4032449) 19770600
Tooyama et al. (6719144) 20040400
(2002-80950) 20020300
Lannert (3002625) 19611000
Kawashima et al. (6235208) 20010500
Jackson (4872977) 19891000
Kawashima et al. (6214218) 20010400
Stanley (2317416) 19430400
Tooyama et al. (20020005376) 20020100
(64-71572) 19890300
Takano et al. (20020027157) 20020300
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