Polishing pads and methods relating thereto

This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and pol...

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Bibliographic Details
Main Authors Roberts, John H. V, James, David B, Cook, Lee Melbourne
Format Patent
LanguageEnglish
Published 22.03.2005
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Summary:This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.