Lead on chip type semiconductor package
1. Field of the Invention An LOC type semiconductor package has a lead frame with leads divided into general leads and stable leads. The ends of the general leads are at the periphery of the semiconductor chip and separated from the semiconductor chip, such that the general leads do not come into co...
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Main Author | |
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Format | Patent |
Language | English |
Published |
21.09.2004
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Online Access | Get full text |
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