Lead on chip type semiconductor package

1. Field of the Invention An LOC type semiconductor package has a lead frame with leads divided into general leads and stable leads. The ends of the general leads are at the periphery of the semiconductor chip and separated from the semiconductor chip, such that the general leads do not come into co...

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Main Author Lee, Jong-Myoung
Format Patent
LanguageEnglish
Published 21.09.2004
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Abstract 1. Field of the Invention An LOC type semiconductor package has a lead frame with leads divided into general leads and stable leads. The ends of the general leads are at the periphery of the semiconductor chip and separated from the semiconductor chip, such that the general leads do not come into contact with the semiconductor chip. The ends of the stable leads attach to a central portion of the surface of the semiconductor chip. Accordingly, since all the inner leads are not collectively arranged on the surface of the semiconductor chip but only the stable inner leads are located thereon, semiconductor chips in a variety of sizes can be mounted on the lead frame. Thus, there is no need for a new lead frame design whenever the semiconductor chip size is changed and a single lead frame design can be mass produced for use in several different products.
AbstractList 1. Field of the Invention An LOC type semiconductor package has a lead frame with leads divided into general leads and stable leads. The ends of the general leads are at the periphery of the semiconductor chip and separated from the semiconductor chip, such that the general leads do not come into contact with the semiconductor chip. The ends of the stable leads attach to a central portion of the surface of the semiconductor chip. Accordingly, since all the inner leads are not collectively arranged on the surface of the semiconductor chip but only the stable inner leads are located thereon, semiconductor chips in a variety of sizes can be mounted on the lead frame. Thus, there is no need for a new lead frame design whenever the semiconductor chip size is changed and a single lead frame design can be mass produced for use in several different products.
Author Lee, Jong-Myoung
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References Sohn et al. (5428247) 19950600
Takeuchi (5977614) 19991100
Iwaya et al. (6392295) 20020500
Cho (5834830) 19981100
Tsubosaki et al. (6137159) 20001000
Russell (6268643) 20010700
Sugiyama et al. (6297545) 20011000
Ohi et al. (5235207) 19930800
Moden (5733800) 19980300
Safai et al. (5572066) 19961100
Murakami et al. (5821606) 19981000
Russell (5545920) 19960800
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Snippet 1. Field of the Invention An LOC type semiconductor package has a lead frame with leads divided into general leads and stable leads. The ends of the general...
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Title Lead on chip type semiconductor package
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