Electronic structures with reduced capacitance

This invention relates to passive components integrated on an integrated circuit chip, an integrated circuit carrier, and a circuit board. An apparatus and method is described incorporating one or more layers of SiCOH and one or more layers of patterned conductors in an integrated circuit chip. The...

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Bibliographic Details
Main Authors Gates, Stephen McConnell, Grill, Alfred
Format Patent
LanguageEnglish
Published 18.05.2004
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Summary:This invention relates to passive components integrated on an integrated circuit chip, an integrated circuit carrier, and a circuit board. An apparatus and method is described incorporating one or more layers of SiCOH and one or more layers of patterned conductors in an integrated circuit chip. The invention overcomes the problem of capacitance by lowering the k of the delectric and overcomes the problem of breakdown voltage and the leakage curent by tailoring the composition of SiCOH.