Mounting substrate and mounting method for semiconductor device

• Main Authors: Onodera, Masanori, Nakajyo, Shinsuke, Ikumo, Masamitsu
• Format: Patent
• Language: English
• Published: 29.07.2003

This application is based upon and claims priority of Japanese Patent Application No. 2000-35952 filed on Feb. 14, 2000, the contents being incorporated herein by reference. A mounting substrate and related mounting method for a semiconductor device. The mounting substrate includes a mounting area to which the semiconductor device is to be mounted and fixed by an adhesive, a peripheral channel formed in the mounting substrate so as to surround the mounting area, and radial channels extending radially from the center towards the periphery of the mounting area. An adhesive is applied at least to either the center of the mounting surface of the semiconductor device or the center of the mounting area of the mounting substrate. The semiconductor device is placed on the mounting area and the adhesive flows outwardly along the radial channels, with the adhesive then being cured. The peripheral channel provides control of the amount of adhesive which flows to the outside of the semiconductor device and the mounting area. The adhesive overflow can be adjusted such that adhesive climbs up the sides of the semiconductor device but not reach the upper surface of the device.