Production of diaphragms over a cavity by grinding to reduce wafer thickness

This invention relates to micromachined silicon diaphragms and specifically to methods of manufacturing such diaphragms. A method of manufacturing a diaphragm utilising a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on u...

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Bibliographic Details
Main Authors Gamble, Harold S, Mitchell, S J Neil, Prochaska, Andrzej, Fitzgerald, Stephen Peter
Format Patent
LanguageEnglish
Published 22.04.2003
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Summary:This invention relates to micromachined silicon diaphragms and specifically to methods of manufacturing such diaphragms. A method of manufacturing a diaphragm utilising a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on use of a sacrificial layer of porous silicon is disclosed.