Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
1. Technical Field A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal connection to the conductive pad (e.g., a chip-to-package connection). The conducti...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
01.10.2002
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Online Access | Get full text |
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Summary: | 1. Technical Field
A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal connection to the conductive pad (e.g., a chip-to-package connection). The conductive pad may include a metal such as copper, aluminum, or tungsten. The self-aligned process generates a metallic layer on an initially exposed metal layer, wherein the metallic layer is electrically conductive and corrosion resistant. The process may be accomplished by providing a substrate having a metal layer with an exposed surface, depositing a second metal layer on the exposed surface, annealing the substrate to alloy a portion of the metal layer that includes the exposed surface and a portion of the second metal layer, and removing the unalloyed portion of the second metal layer. |
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