Method of making differently sized vias and lines on the same lithography level

• Main Authors: Furukawa, Toshiharu, Hakey, Mark C, Holmes, Steven J, Horak, David V, Ma, William H-L
• Format: Patent
• Language: English
• Published: 03.09.2002

1. Field of the Invention Features of two or more distinct sizes designed to optimize performance of an integrated circuit device are formed by transferring a pattern from a resist patterned with features of a single minimum feature size for which a resist exposure tool is optimized to a layer of preferably soluble material such as germanium oxide. Portions of this pattern are then enlarged using a block-out mask and the resulting pattern transferred to a further underlying layer preferably using an anisotropic reactive ion etch. The soluble material can then be removed leaving a robust mask with differing feature sizes for further processing. Preferably, Damascene conductive lines and vias are formed by providing an insulator as the further underlying material and filling the openings with metal or other conductive material.