Coated means for connecting a chip and a card

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu dendrite growth and lead bending during power and thermal cycling are substantially reduced or e...

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Bibliographic Details
Main Authors Feger, Claudius, Graham, Teresita Ordonez, Grebe, Kurt Rudolph, Lanzetta, Alphonso Philip, Liutkus, John Joseph, Matthew, Linda Carolyn, Palmer, Michael Jon, Tanner, Nelson Russell, Tong, Ho-Ming, Wilson, Charles Haile, Yeh, Helen Li
Format Patent
LanguageEnglish
Published 11.06.2002
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Summary:The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu dendrite growth and lead bending during power and thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same. A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.