Drying apparatus and method
1. Field of the Invention A tank stores a drying liquid for drying a semiconductor wafer. A boat vertically holds a plurality of target semiconductor wafers to be dried. The semiconductor wafers which are held by the boat are entirely soaked in the drying liquid. After this, the semiconductor wafers...
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| Format | Patent |
| Language | English |
| Published |
19.03.2002
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| Online Access | Get full text |
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| Summary: | 1. Field of the Invention
A tank stores a drying liquid for drying a semiconductor wafer. A boat vertically holds a plurality of target semiconductor wafers to be dried. The semiconductor wafers which are held by the boat are entirely soaked in the drying liquid. After this, the semiconductor wafers are lifted from the drying liquid at a rate in a range from 1 to 3 mm/min, so as to be dried. At this time, the surface of the drying liquid is divided with using a dividing liquid at each side of the semiconductor wafer. The dividing plate divides the surface of the drying liquid, thereby to prevent particles, which are once removed from the semiconductor wafer, from being again adhered onto the semiconductor wafer. |
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