Flip-chip system and method of making same

A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that i...

Full description

Saved in:
Bibliographic Details
Main Authors Wakharkar, Vijay, Jayaraman, Saikumar
Format Patent
LanguageEnglish
Published 23.09.2004
Online AccessGet full text

Cover

More Information
Summary:A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.