Method for forming scribed groove and scribing apparatus

• Main Authors: Imai, Hiroshi, Ohno, Yuji, Nakase, Yoshito
• Format: Patent
• Language: English
• Published: 01.07.2004

A method for forming scribed grooves on a wafer and an apparatus for implementing the method. The method moves the cutting part such that its cutting edge forms an inverted trapezoid-shaped path, thereby reducing the scribing angle of the cutting edge to an acute angle. Consequently, the stress prod...