Method for forming scribed groove and scribing apparatus
A method for forming scribed grooves on a wafer and an apparatus for implementing the method. The method moves the cutting part such that its cutting edge forms an inverted trapezoid-shaped path, thereby reducing the scribing angle of the cutting edge to an acute angle. Consequently, the stress prod...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
01.07.2004
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Online Access | Get full text |
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