Transfer body and method using the same

There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting b...

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Main Authors Sato, Hisashi, Furukawa, Tadahiro, Bekku, Ichiro, Arai, Kazumi
Format Patent
LanguageEnglish
Published 08.04.2004
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Abstract There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting body and a large rigidity compared with an opponent member to which the layers are to be transferred, and wherein the peelable layer is formed to have a pull strength of 100 g/cm or more.
AbstractList There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting body and a large rigidity compared with an opponent member to which the layers are to be transferred, and wherein the peelable layer is formed to have a pull strength of 100 g/cm or more.
Author Bekku, Ichiro
Furukawa, Tadahiro
Sato, Hisashi
Arai, Kazumi
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  fullname: Arai, Kazumi
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Snippet There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a...
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Title Transfer body and method using the same
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