Drain-extended MOS ESD protection structure

A protection structure ( 30; 30′; 30″ ) for safely conducting charge from electrostatic discharge (ESD) at a terminal (IN) is disclosed. The protection structure ( 30; 30′; 30″ ) includes a pair of drain-extended metal-oxide-semiconductor (MOS) transistors ( 32, 34 ). In a pump transistors ( 32 ), t...

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Main Authors Kunz, Keith, Duvvury, Charvaka, Mosher, Dan
Format Patent
LanguageEnglish
Published 12.02.2004
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Abstract A protection structure ( 30; 30′; 30″ ) for safely conducting charge from electrostatic discharge (ESD) at a terminal (IN) is disclosed. The protection structure ( 30; 30′; 30″ ) includes a pair of drain-extended metal-oxide-semiconductor (MOS) transistors ( 32, 34 ). In a pump transistors ( 32 ), the gate electrode ( 45 ) overlaps a portion of a well ( 42 ) in which the drain ( 44 ) is disposed, to provide a significant gate-to-drain capacitance. The drains of the transistors ( 32, 34 ) are connected together and to the terminal (IN), while the gates of the transistors ( 32, 34 ) are connected together. The source of one transistor ( 32 ) is connected to a guard ring ( 50 ), of the same conductivity type as the substrate ( 40 ) within which the channel region of the other transistors ( 34 ) is disposed. An ESD event received at the terminal (IN) is thus coupled to the gate of the transistors ( 32, 34 ), causing conduction to the substrate ( 40 ) via the guard ring ( 50 ), and turning on a parasitic bipolar transistor at the other transistor ( 34 ), safely conducting the ESD current. One alternative structure ( 30′ ) includes a junction capacitor ( 65 ) coupled between the terminal (IN) and the gates of the transistors ( 32, 34 ) to improve the coupling. Another alternative structure ( 30″ ) includes a clamping diode ( 92 ) that also presents a parasitic bipolar transistor ( 95 ) enhancing the current conducted to the substrate ( 40 ).
AbstractList A protection structure ( 30; 30′; 30″ ) for safely conducting charge from electrostatic discharge (ESD) at a terminal (IN) is disclosed. The protection structure ( 30; 30′; 30″ ) includes a pair of drain-extended metal-oxide-semiconductor (MOS) transistors ( 32, 34 ). In a pump transistors ( 32 ), the gate electrode ( 45 ) overlaps a portion of a well ( 42 ) in which the drain ( 44 ) is disposed, to provide a significant gate-to-drain capacitance. The drains of the transistors ( 32, 34 ) are connected together and to the terminal (IN), while the gates of the transistors ( 32, 34 ) are connected together. The source of one transistor ( 32 ) is connected to a guard ring ( 50 ), of the same conductivity type as the substrate ( 40 ) within which the channel region of the other transistors ( 34 ) is disposed. An ESD event received at the terminal (IN) is thus coupled to the gate of the transistors ( 32, 34 ), causing conduction to the substrate ( 40 ) via the guard ring ( 50 ), and turning on a parasitic bipolar transistor at the other transistor ( 34 ), safely conducting the ESD current. One alternative structure ( 30′ ) includes a junction capacitor ( 65 ) coupled between the terminal (IN) and the gates of the transistors ( 32, 34 ) to improve the coupling. Another alternative structure ( 30″ ) includes a clamping diode ( 92 ) that also presents a parasitic bipolar transistor ( 95 ) enhancing the current conducted to the substrate ( 40 ).
Author Duvvury, Charvaka
Mosher, Dan
Kunz, Keith
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Snippet A protection structure ( 30; 30′; 30″ ) for safely conducting charge from electrostatic discharge (ESD) at a terminal (IN) is disclosed. The protection...
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