Method for converting a reclaim wafer into a semiconductor wafer

• Main Author: Wenski, Guido
• Format: Patent
• Language: English
• Published: 08.11.2001

A method to convert a reclaim wafer into a semiconductor wafer, suitable as starting material for semiconductor fabrication, with a front surface, a back surface and an edge. At least one of the two surfaces bearing foreign material which originates from at least one process for the fabrication of s...