RESIST COMPOSITION AND PATTERN FORMING PROCESS
A resist composition comprising, in a resist, an additive which has a melting point of 160° C. or above, contains no aromatic ring, has a molecular size of no greater than 50 and is soluble in the developing solution for the resist, at 1-50 parts by weight with respect to 100 parts by solid weight o...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
05.07.2001
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Online Access | Get full text |
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