Development of a Dicing Blade with Combined Structure Utilizing Photocurable Resins
A diamond blade is widely used as a cutting tool for slicing materials such as stones, ceramics and glasses in a straight line. Generally, it has many slots and their functions have the effect of reducing cutting resistance and increasing the tool life. Against this background, the application of ph...
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| Published in | Nihon Kikai Gakkai ronbunshū. C Vol. 19; no. 9; pp. 2631 - 2636 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | Japanese |
| Published |
01.09.2007
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| Online Access | Get full text |
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| Summary: | A diamond blade is widely used as a cutting tool for slicing materials such as stones, ceramics and glasses in a straight line. Generally, it has many slots and their functions have the effect of reducing cutting resistance and increasing the tool life. Against this background, the application of photocurable resins to the blade with slots has been examined on both single-layered blade and multi-layered blade. In this paper, a combined-structure blade was proposed and experiments were performed to investigate cutting characteristics during dicing. As the results of a series of cutting tests on silicon wafers utilizing the combined-structure blade, the remarkable improvement of cutting performance was verified. |
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| Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 content type line 23 ObjectType-Feature-1 |
| ISSN: | 0387-5024 |