Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
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Published in | Journal of electronic materials Vol. 43; no. 12; pp. 4457 - 4463 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Heidelberg
Springer
2014
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Subjects | |
Online Access | Get full text |
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