Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow: Recent topics in electronics cooling-From transistors to systems - SUNG JIN KIM; KIM, Dong-Kwon; HWAN HEE OH (Heat transfer engineering, 2008)
Keywords: Applied sciences; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Electronic equipment; Cooling system; Parallel flow; Heat sink; Comparative study; Finned surface; Heat transfer