A statistical study of Sn whisker population and growth during elevated temperature and humidity tests : Special section on tin whiskers

• Published in: IEEE transactions on electronics packaging manufacturing Vol. 29; no. 4; pp. 246 - 251
• Main Authors: PENG SU, HOWELL, Jim, CHOPIN, Sheila
• Format: Journal Article
• Language: English
• Published: New York, NY Institute of Electrical and Electronics Engineers 2006
• Subjects: Applied sciences; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Microelectronic fabrication (materials and surfaces technology); Physics; Scanning probe microscopes, components and techniques; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Scanning electron microscopy; Nucleation; electroplating; whisker growth; Growth rate; Printed circuit board; Statistical study; tin finish; Microelectronic fabrication; Optical microscopy; Corrosion; Growth mechanism; Electrodeposition; Printed circuit; lead-free; Backscatter