Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures
We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measureme...
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| Published in | Scripta materialia Vol. 143; no. C |
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| Main Authors | , , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
United States
Elsevier
01.01.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measurements were used to determine grain size evolution at the interface, in agreement with reports of softening in highly nanotwinned copper. We also show evidence of a direct correlation between surface grain size and friction coefficient, validating a model linking friction in pure metals and the transition from dislocation mediated plasticity to grain boundary sliding. |
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| AbstractList | We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is possible to generate a quasi-stable ultra-nanocrystalline surface layer with reduced strength. In situ electrical contact resistance measurements were used to determine grain size evolution at the interface, in agreement with reports of softening in highly nanotwinned copper. We also show evidence of a direct correlation between surface grain size and friction coefficient, validating a model linking friction in pure metals and the transition from dislocation mediated plasticity to grain boundary sliding. |
| Author | Babuska, Tomas F. Curry, John F. Nation, Brendan L. Kustas, Andrew B. Chandross, Michael Furnish, Timothy A. Argibay, Nicolas Staats, Wayne L. Lu, Ping |
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| BackLink | https://www.osti.gov/biblio/1734792$$D View this record in Osti.gov |
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| Snippet | We demonstrate inverse Hall-Petch behavior (softening) in pure copper sliding contacts at cryogenic temperatures. By kinetically limiting grain growth, it is... |
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| Title | Shear-induced softening of nanocrystalline metal interfaces at cryogenic temperatures |
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