솔더 페이스트 분말 입도와 기판 표면처리에 따른 접합부 열화 특성
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| Published in | 대한용접·접합학회지 Vol. 40; no. 3; pp. 216 - 223 |
|---|---|
| Main Authors | , , , |
| Format | Journal Article |
| Language | Korean |
| Published |
대한용접·접합학회
2022
|
| Online Access | Get full text |
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| Author | 이혜민(Hye-Min Lee) 김미송(Mi-Song Kim) 홍원식(Won Sik Hong) 김명인(Myeongin Kim) |
|---|---|
| Author_xml | – sequence: 1 fullname: 김미송(Mi-Song Kim) – sequence: 2 fullname: 홍원식(Won Sik Hong) – sequence: 3 fullname: 이혜민(Hye-Min Lee) – sequence: 4 fullname: 김명인(Myeongin Kim) |
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| DocumentTitle_FL | Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints |
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| Title | 솔더 페이스트 분말 입도와 기판 표면처리에 따른 접합부 열화 특성 |
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