A 7-nm 4-GHz Arm^1-Core-Based CoWoS^1 Chiplet Design for High-Performance Computing
We present a dual-chiplet interposer-based system-in-package (SiP) octo-core processor using Chip-on-Wafer-on-Substrate (CoWoS) technology. Each of the two identical chiplets is implemented in 7-nm CMOS with 15 metal layers and has four Arm Cortex-A72 processor cores operating at 4.0 GHz. A bidirect...
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Published in | IEEE journal of solid-state circuits pp. 1 - 11 |
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Main Authors | , , , , , , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
26.02.2020
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Subjects | |
Online Access | Get full text |
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