A 7-nm 4-GHz Arm^1-Core-Based CoWoS^1 Chiplet Design for High-Performance Computing

We present a dual-chiplet interposer-based system-in-package (SiP) octo-core processor using Chip-on-Wafer-on-Substrate (CoWoS) technology. Each of the two identical chiplets is implemented in 7-nm CMOS with 15 metal layers and has four Arm Cortex-A72 processor cores operating at 4.0 GHz. A bidirect...

Full description

Saved in:
Bibliographic Details
Published inIEEE journal of solid-state circuits pp. 1 - 11
Main Authors Lin, Mu-Shan, Goel, Sandeep Kumar, Fu, Chin-Ming, Rusu, Stefan, Li, Chao-Chieh, Yang, Sheng-Yao, Wong, Mei, Yang, Shu-Chun, Lee, Frank, Huang, Tze-Chiang, Tsai, Chien-Chun, Tam, King-Ho, Hsieh, Kenny Cheng-Hsiang, Chen, Ching-Fang, Huang, Wen-Hung, Hu, Chi-Wei, Chen, Yu-Chi
Format Journal Article
LanguageEnglish
Published IEEE 26.02.2020
Subjects
Online AccessGet full text

Cover

Loading…