Synchrotron-based x-ray diffraction analysis of energetic ion-induced strain in GaAs and 4H-SiC
Strain engineering using ion beams is a current topic of research interest in semiconductor materials. Synchrotron-based high-resolution x-ray diffraction has been utilized for strain-depth analysis in GaAs irradiated with 300 keV Ar and 4H-SiC and GaAs irradiated with 100 MeV Ag ions. The direct di...
Saved in:
Published in | Journal of applied physics Vol. 136; no. 3 |
---|---|
Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
American Institute of Physics
2024
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!