First-Principles Study of Cu Addition on Mechanical Properties of Ni[sub.3]Sn[sub.4]-Based Intermetallic Compounds

• Published in: Metals (Basel ) Vol. 14; no. 1
• Main Authors: Yao, Jinye, Wang, Li, Guo, Shihao, Li, Xiaofu, Chen, Xiangxu, Shang, Min, Ma, Haoran, Ma, Haitao
• Format: Journal Article
• Language: English
• Published: MDPI AG 01.01.2024
• Subjects: Force and energy; Intermetallic compounds; Mechanical properties

Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic co...