THERMOPLASTIC POLYAMIDE MOULDING COMPOSITIONS

• Main Authors: BRINKMANN L, KIRSCH G, HERWIG W
• Format: Patent
• Language: English
• Published: 29.10.1975
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The materials are composed of (a) 2-80 wt. % (esp. 10-40 wt. %) of a solid mineral filler with particle size of 20 mu, pref. 0.1-10 mu, and (b) 98-20 wt. % esp. 90-60 wt. % of >=1 amorphous polyamide derived from (I) 5-50 mole%, pref. 10-35 mole% of 1,3-bis-(aminomethyl)-cyclohexane and/or 1,4-bi...