PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

• Main Authors: HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
• Format: Patent
• Language: English; French; Japanese
• Published: 28.01.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A punched adhesive tape for semiconductor, which comprises a base film and an adhesive layer on one or both surfaces of the base film. A portion of the adhesive tape where a foreign matter or a defect is present is marked with a punched hole. A method of making a lead frame to which such an adhesive...