PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
A punched adhesive tape for semiconductor, which comprises a base film and an adhesive layer on one or both surfaces of the base film. A portion of the adhesive tape where a foreign matter or a defect is present is marked with a punched hole. A method of making a lead frame to which such an adhesive...
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| Main Authors | , , , , , |
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| Format | Patent |
| Language | English French Japanese |
| Published |
28.01.1999
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | A punched adhesive tape for semiconductor, which comprises a base film and an adhesive layer on one or both surfaces of the base film. A portion of the adhesive tape where a foreign matter or a defect is present is marked with a punched hole. A method of making a lead frame to which such an adhesive tape is attached, comprises blanking the adhesive tape while skipping portions having marking holes, and bonding a piece of adhesive tape to the lead frame. A semiconductor device comprises such a lead frame to which such an adhesive tape is attached.
La présente invention concerne un ruban adhésif perforé pour semi-conducteur constitué d'un film base avec une couche adhésive sur l'une au moins de ses faces. On repère d'une perforation une partie du ruban adhésif comportant un corps étranger ou un défaut. L'invention concerne également le procédé de fabrication d'une araignée de connexions sur laquelle on fait tenir un tel ruban adhésif. Ce procédé consiste à découper au poinçon dans le ruban adhésif les zones repérées par les perforations, et à fixer un morceau de ruban adhésif sur l'araignée de connexions. L'invention concerne enfin un dispositif à semi-conducteurs comprenant une telle araignée de connexions à laquelle est fixé un tel ruban adhésif. |
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| AbstractList | A punched adhesive tape for semiconductor, which comprises a base film and an adhesive layer on one or both surfaces of the base film. A portion of the adhesive tape where a foreign matter or a defect is present is marked with a punched hole. A method of making a lead frame to which such an adhesive tape is attached, comprises blanking the adhesive tape while skipping portions having marking holes, and bonding a piece of adhesive tape to the lead frame. A semiconductor device comprises such a lead frame to which such an adhesive tape is attached.
La présente invention concerne un ruban adhésif perforé pour semi-conducteur constitué d'un film base avec une couche adhésive sur l'une au moins de ses faces. On repère d'une perforation une partie du ruban adhésif comportant un corps étranger ou un défaut. L'invention concerne également le procédé de fabrication d'une araignée de connexions sur laquelle on fait tenir un tel ruban adhésif. Ce procédé consiste à découper au poinçon dans le ruban adhésif les zones repérées par les perforations, et à fixer un morceau de ruban adhésif sur l'araignée de connexions. L'invention concerne enfin un dispositif à semi-conducteurs comprenant une telle araignée de connexions à laquelle est fixé un tel ruban adhésif. |
| Author | IIOKA, SHINJI KIRIHARA, HIROSHI NOMURA, YOSHIHIRO YANAGISAWA, SATORU HOSOKAWA, YOUICHI TANABE, YOSHIYUKI |
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| DocumentTitleAlternate | RUBAN ADHESIF PERFORE POUR SEMI-CONDUCTEUR, FABRICATION D'ARAIGNEE DE CONNEXIONS AVEC LE RUBAN ADHESIF, ARAIGNEE DE CONNEXIONS AVEC LE RUBAN ADHESIF, ET DISPOSITIF A SEMI-CONDUCTEURS COMPORTANT CETTE ARAIGNEE DE CONNEXIONS |
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| Notes | Application Number: WO1998JP03072 |
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| RelatedCompanies | IIOKA, SHINJI HITACHI CHEMICAL COMPANY, LTD KIRIHARA, HIROSHI NOMURA, YOSHIHIRO YANAGISAWA, SATORU HOSOKAWA, YOUICHI TANABE, YOSHIYUKI |
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| Snippet | A punched adhesive tape for semiconductor, which comprises a base film and an adhesive layer on one or both surfaces of the base film. A portion of the... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME |
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