LAMINATOR

• Main Author: MATSUO, TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 18.12.1986
• Edition: 4
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; CUTTING; CUTTING-OUT; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HAND CUTTING TOOLS; HOLOGRAPHY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORATING; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; PUNCHING; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; STAMPING-OUT; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A laminator for use in attaching a film (4) cut to a predetermined length to a substrate (1) having positioning holes (guide holes). A boring unit (30) for making holes (through holes of a predetermined size in the portions of the film (4) which correspond to the positioning holes in the substrate (1) is provided in a predetermined position in a film feed path along which the film (4) is supplied from a film feeder to the upper surface of the substrate (1). Owing to this arrangement, the present invention enables holes to be made in the portions of the film (4) which correspond to the positions of the positioning holes in the substrate (1), before the film (4) has been attached to the substrate (1) or while the film (4) is attached to the substrate (1). Accordingly, the operation efficiency can be improved. The laminator is further provided with a device for removing chips of the film (4), which occur when the holes are made in the film (4) with the boring unit (30). Owing to this device, the holes can be formed in the mentioned portions of the film (4) with the chips thereof removed at the same time, before the film (4) has been attached to the substrate (1) or while the film (4) is attached to the substrate (1). Therefore, the yield of the laminated products can be improved. Un laminoir est utilisé pour attacher une pellicule (4) d'une longueur prédéterminée à un substrat (1) pourvu d'orifices de localisation (orifices de guidage). Une unité poinçonneuse (30) pour percer des orifices d'une grandeur prédéterminée dans les parties de la pellicule (4) qui correspondent aux orifices de localisation du substrat (1) est agencée à une position prédéterminée sur un trajet d'alimentation que suit la pellicule (4) lorsqu'elle est appliquée par un dispositif d'alimentation à la surface supérieure du substrat (1). Cet agencement permet de percer des orifices dans les parties de la pellicule (4) qui correspondent aux positions des orifices de localisation du substrat (1) avant ou après que la pellicule (4) ait été attachée au substrat (1), ce qui améliore le rendement de l'opération. Le laminoir est également pourvu d'un dispositif d'élimination des ébarbures de la pellicule (4) qui sont produites lorsque l'unité poinçonneuse (30) perce les orifices dans la pellicule (4). Les orifices sont ainsi formés dans les parties mentionnées de la pellicule (4) en même temps que les ébarbures sont éliminées, avant ou après qu la pellicule (4) ait été attachée au substrat (1), ce qui permet d'obtenir un plus grand rendement de produits laminés.