COPOLYMER, POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMATION METHOD
The purpose of the present invention is to provide a copolymer and a positive resist composition, which make it possible to form a resist pattern that has a wide light exposure margin and a favorable shape. A copolymer according to the present invention is characterized by comprising a monomer unit...
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03.10.2024
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Abstract | The purpose of the present invention is to provide a copolymer and a positive resist composition, which make it possible to form a resist pattern that has a wide light exposure margin and a favorable shape. A copolymer according to the present invention is characterized by comprising a monomer unit (I) represented by formula (I) and a monomer unit (II) represented by formula (II). In the formulae, R1, R2, R3, R4, R5, R6, R7 and R8 each represent a specific group, and p represents an integer of 0 to 5 (inclusive).
Le but de la présente invention est de fournir un copolymère et une composition de résine positive qui permettent de former un motif de résine ayant une large marge d'exposition à la lumière et une forme favorable. Un copolymère selon la présente invention est caractérisé en ce qu'il comprend une unité monomère (I) représentée par la formule (I) et une unité monomère (II) représentée par la formule (II). Dans les formules, R1, R2, R3, R4, R5, R6, R7 et R8 représentent chacun un groupe spécifique, et p représente un nombre entier de 0 à 5 (inclus).
本発明は、露光マージンが広く、かつ、良好な形状を有するレジストパターンを形成可能な共重合体およびポジ型レジスト組成物を提供することを目的とする。本発明の共重合体は、下記式(I)で表わされる単量体単位(I)と、下記式(II)で表わされる単量体単位(II)とを含むことを特徴とする。なお、式中、R1、R2、R3、R4、R5、R6、R7、R8は、それぞれ所定の基であり、pは、0以上5以下の整数である。 |
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AbstractList | The purpose of the present invention is to provide a copolymer and a positive resist composition, which make it possible to form a resist pattern that has a wide light exposure margin and a favorable shape. A copolymer according to the present invention is characterized by comprising a monomer unit (I) represented by formula (I) and a monomer unit (II) represented by formula (II). In the formulae, R1, R2, R3, R4, R5, R6, R7 and R8 each represent a specific group, and p represents an integer of 0 to 5 (inclusive).
Le but de la présente invention est de fournir un copolymère et une composition de résine positive qui permettent de former un motif de résine ayant une large marge d'exposition à la lumière et une forme favorable. Un copolymère selon la présente invention est caractérisé en ce qu'il comprend une unité monomère (I) représentée par la formule (I) et une unité monomère (II) représentée par la formule (II). Dans les formules, R1, R2, R3, R4, R5, R6, R7 et R8 représentent chacun un groupe spécifique, et p représente un nombre entier de 0 à 5 (inclus).
本発明は、露光マージンが広く、かつ、良好な形状を有するレジストパターンを形成可能な共重合体およびポジ型レジスト組成物を提供することを目的とする。本発明の共重合体は、下記式(I)で表わされる単量体単位(I)と、下記式(II)で表わされる単量体単位(II)とを含むことを特徴とする。なお、式中、R1、R2、R3、R4、R5、R6、R7、R8は、それぞれ所定の基であり、pは、0以上5以下の整数である。 |
Author | KAWAUE Akiya UMEDA Masaya |
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DocumentTitleAlternate | COPOLYMÈRE, COMPOSITION DE RÉSINE POSITIVE ET PROCÉDÉ DE FORMATION DE MOTIF DE RÉSINE 共重合体、ポジ型レジスト組成物、およびレジストパターン形成方法 |
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Snippet | The purpose of the present invention is to provide a copolymer and a positive resist composition, which make it possible to form a resist pattern that has a... |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
Title | COPOLYMER, POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMATION METHOD |
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