LASER REMOVAL METHOD, METHOD FOR MANUFACTURING ROTARY ELECTRICAL MACHINE, AND LASER REMOVAL DEVICE

A laser removal method according to an embodiment involves using laser light to irradiate a filmy body formed on a substrate to remove the filmy body. In the laser removal method, the filmy body is irradiated with laser light having a wavelength that does not tend to be absorbed in the filmy body in...

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Main Authors OBARA, Go, KIKAWADA, Masakazu
Format Patent
LanguageEnglish
French
Japanese
Published 03.10.2024
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Abstract A laser removal method according to an embodiment involves using laser light to irradiate a filmy body formed on a substrate to remove the filmy body. In the laser removal method, the filmy body is irradiated with laser light having a wavelength that does not tend to be absorbed in the filmy body in one photon, and multiphoton absorption is caused at a predetermined position inside the filmy body. Un procédé d'ablation au laser selon un mode de réalisation met en œuvre l'utilisation d'une lumière laser pour exposer un corps en forme de film formé sur un substrat à un rayonnement pour retirer le corps en forme de film. Dans le procédé d'ablation au laser, le corps en forme de film est exposé à un rayonnement de lumière laser ayant une longueur d'onde qui n'a pas tendance à être absorbée dans le corps en forme de film dans un photon, et une absorption multiphotonique est provoquée à une position prédéterminée à l'intérieur du corps en forme de film. 実施形態に係るレーザ除去方法は、樹脂を含み、基材の上に形成された膜状体にレーザ光を照射して、前記膜状体を除去するレーザ除去方法である。前記レーザ除去方法は、一光子では前記膜状体において吸収が生じ難い波長を有するレーザ光を前記膜状体に照射し、前記膜状体の内部の所定の位置において、多光子吸収を生じさせる。
AbstractList A laser removal method according to an embodiment involves using laser light to irradiate a filmy body formed on a substrate to remove the filmy body. In the laser removal method, the filmy body is irradiated with laser light having a wavelength that does not tend to be absorbed in the filmy body in one photon, and multiphoton absorption is caused at a predetermined position inside the filmy body. Un procédé d'ablation au laser selon un mode de réalisation met en œuvre l'utilisation d'une lumière laser pour exposer un corps en forme de film formé sur un substrat à un rayonnement pour retirer le corps en forme de film. Dans le procédé d'ablation au laser, le corps en forme de film est exposé à un rayonnement de lumière laser ayant une longueur d'onde qui n'a pas tendance à être absorbée dans le corps en forme de film dans un photon, et une absorption multiphotonique est provoquée à une position prédéterminée à l'intérieur du corps en forme de film. 実施形態に係るレーザ除去方法は、樹脂を含み、基材の上に形成された膜状体にレーザ光を照射して、前記膜状体を除去するレーザ除去方法である。前記レーザ除去方法は、一光子では前記膜状体において吸収が生じ難い波長を有するレーザ光を前記膜状体に照射し、前記膜状体の内部の所定の位置において、多光子吸収を生じさせる。
Author KIKAWADA, Masakazu
OBARA, Go
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DocumentTitleAlternate PROCÉDÉ D'ABLATION AU LASER, PROCÉDÉ DE FABRICATION DE MACHINE ÉLECTRIQUE ROTATIVE, ET DISPOSITIF D'ABLATION AU LASER
レーザ除去方法、回転電機の製造方法、およびレーザ除去装置
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RelatedCompanies KABUSHIKI KAISHA TOSHIBA
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
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Snippet A laser removal method according to an embodiment involves using laser light to irradiate a filmy body formed on a substrate to remove the filmy body. In the...
SourceID epo
SourceType Open Access Repository
SubjectTerms AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CLADDING OR PLATING BY SOLDERING OR WELDING
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DYNAMO-ELECTRIC MACHINES
ELECTRICITY
GENERATION
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Title LASER REMOVAL METHOD, METHOD FOR MANUFACTURING ROTARY ELECTRICAL MACHINE, AND LASER REMOVAL DEVICE
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